news & topics │ research & development │ rohm semiconductor -凯发k8一触即发

updated publications (power electronics: publications 1 case)

power electronics

publications

2024/08
mechanical characterization of sintered silver materials for power device packaging: a review

updated presentations（power electronics: presentations 3 case、others: presentations 2 case）

power electronics

presentations

2024/07
4h-sic remote epitaxy for wafer cost reduction

2024/07
two-step growth of epitaxial graphene to suppress the in-process step bunching of sic substrate

2024/07
high c/si ratio growth of 4h-sic on epitaxial graphene/4h-sic substrates

others

presentations

2024/07
structural verification of sic remote epitaxial layers on the terrace using first-principles calculations

2024/07
adhesion strength evaluation of sic remote epilayers exfoliation using density functional theory（dft）

updated publications(power electronics: publications 1 case)

power electronics

publications

2024/06
effect of the conduction resistance of sic mosfet on the harmonics of inverter voltage in wireless power-transfer systems for electric vehicle

updated publications(sensor technology: publications 1 case)

sensor technology

publications

2024/05
limiting current-type oxygen and humidity microsensor

updated publications & presentations (power electronics: publications 1 case, others: presentations 3 case)

others

presentations

2024/03
electrical characterization of si capacitor with tsv electrode

2024/03
mode-dependent variations of eigenfrequencies in the one-dimensional su–schrieffer–heeger electrical circuit: experimental demonstration

2024/03
control of the morphology and the number of layers of graphene on sic

power electronics

publications

2024/01
fracture mechanism of sintered silver film revealed by in-situ sem uniaxial tensile loading

updated presentations(sensor technology: presentations 1 case)

sensor technology

presentations

2023/12
toward the practical application of terahertz resonant tunneling diodes

updated publications(sensor technology: publications 1 case)

sensor technology

publications

2023/10
low-power and fast-response limiting current-type oxygen microsensor with a wide range oxygen concentration

updated publications(power electronics: publications 4 case)

power electronics

publications

2023/10
development of in-situ measurement method for wire-bonding lifetime utilizing the 4-terminal method

2023/10
comparison of sintered silver die attach failure between thermal shock test and mechanical cycling test

2023/10
degradation mechanism of silver sintering die attach based on thermal and mechanical reliability testing

2023/10
nine point bending test technique for understanding of sintered silver die bonding failure mechanism

updated publications & presentations (power electronics: publications 1 case / presentations 3 case)

power electronics

publications

2023/09
the improved scheme of estimating embedded gate resistance to reproduce sic mosfet circuit performance

presentations

2023/08
development of a high-speed and high-accuracy sic mosfet model applicable to circuit and system simulators

2023/09
effect of the forward and reverse conduction resistance of sic mosfet on the harmonic voltage of the full-bridge inverters of wireless power systems for electric vehicles and its suppression method

2023/09
sputtered β-ga2o3 crystallization by high temperature annealing on aln/si

power electronics

presentations

2023/07
application of remote epitaxy for sic wafer cost reduction

power electronics

presentations

2023/06
performance comparison between igbt and sic during wltc

power electronics

publications

2023/04
performance comparison of si igbt and sic mosfet power module driving ipmsm or im under wltc

presentations

2023/05
conducted noise evaluation of dual-half bridge pfc converter

sensor technology

presentations

2023/05
characteristic improvement of mems-type ultrasonic device with controllable natural frequencies

power electronics

presentations

2023/05
degradation mechanism of sintered silver die attach by thermal and mechanical cycling test

2023/05
simplified open-loop transfer functions to analyze influential parasitic parameters for oscillation caused by parallel connected transistors

2023/06
suppression of leakage current in wireless charging systems using n-legged inverters

sensor technology

presentations

2023/06
extremely small limiting-current-type oxygen sensor with a wide range proportionality of the oxygen concentration

ai

presentations

2023/03
structural optimization of toroidal coils based on neural network and explainable ai

ai

presentations

2023/03
population estimation of characteristic variation in power transistors

2023/06
positioning analysis of semconductor companies for specidfic technology using bert

power electronics

publications

2022/12
dominant model-parameter determination for the analysis of current imbalance across paralleled power transistors

presentations

2023/03
enhancement of linear-polarization degree of emitted beam from photonic-crystal surface-emitting lasers (pcsels)

2023/05
a unified model of mis and ridge hemts for fast and high-power switching applications.

sensor technology

presentations

2023/03
tolerance of eigenfrequencies in the su-schrieffer-heeger electrical circuit

ai

presentations

2023/03
proposal for a market investigation method based on time series analysis of multiple information resources written in natural language.

power electronics

presentations

2023/05
autonomous minimization of power loss by switching frequency adjusting function for a dc–dc converter

ai

presentations

2022/12
principal component analysis based gan transistor live health monitoring

nomadbot™　–no map driving robot-

power electronics

presentations

2022/12
a secondary-side resonant llc converter for reducing resonance voltage with boost mode operation using resonance including current doubler rectifier

2022/12
research on the correlation between power devices and power systems

power electronics

presentations

2022/11
nine point bending test technique for evaluating the sintered silver die degradation

2022/12
sintered silver degradation assessment by thermal and mechanical cyclic tests

2023/01
sic wafer cost reduction with remote epitaxy technology

power electronics

presentations

sintered silver die degradation evaluation by nine point bending test technique

control of current distribution for enhanced robustness of single-mode oscillation in a photonic-crystal surface-emitting laser

evaluating sintered silver die-attach thermal cycling degradation

degradation mechanism comparison of sintered silver die in thermal and mechanical cycling tests

sensor technology

presentations

thz imaging system with a single resonant tunneling diode transceiver in the 300-ghz band

size reduction in imaging system using a single resonant tunneling diode transceiver

power electronics

publications

evaluation of thermal couple impedance model of power modules for accurate die temperature estimation up to 200℃

an evaluation of a new type of high efficiency hybrid gate drive circuit for sic- mosfet suitable for automotive power electronics system applications

presentations

auto structural optimization of toroidal coils based on neural network and genetic algorithm

lpcvd sin film breakdown and n2-anneal temperature (ⅰ) tddb and esr evaluations

lpcvd sin film breakdown and n2-anneal temperature (ⅱ) esr and ftir evaluations

effect of n2-anneal temperature on silicon nitride film:(ⅰ) time-dependent dielectric breakdown and esr evaluations

effect of n2-anneal temperature on silicon nitride film:(ⅱ) fine structures of esr spectrum and ftir

effects of underside-si annealing on charge breakdown of lpcvd sin film

sensor technology

presentations

oxygen and humidity sensing property of a limiting current-type thin-film ysz-based sensor on a micro-hotplate

compact and cost-effective solution for terahertz applications